NTZD3152P
PACKAGE DIMENSIONS
SOT ? 563, 6 LEAD
CASE 463A
ISSUE F
D
? X ?
A
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
6
1
e
5
2
4
3
E
? Y ?
b 65 PL
0.08 (0.003)
M
X Y
H E
C
DIM
A
b
C
D
E
e
L
H E
MILLIMETERS
MIN NOM MAX
0.50 0.55 0.60
0.17 0.22 0.27
0.08 0.12 0.18
1.50 1.60 1.70
1.10 1.20 1.30
0.5 BSC
0.10 0.20 0.30
1.50 1.60 1.70
INCHES
MIN NOM MAX
0.020 0.021 0.023
0.007 0.009 0.011
0.003 0.005 0.007
0.059 0.062 0.066
0.043 0.047 0.051
0.02 BSC
0.004 0.008 0.012
0.059 0.062 0.066
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.0
1.35
0.0531
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm
inches
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NTZD3152P/D
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